SINFONIA(昕芙旎雅株式會(huì)社)成立于1917年,以電磁控制技術(shù)為核心,提供半導(dǎo)體搬送裝置、宇宙火箭電氣部件、汽車實(shí)驗(yàn)裝置測(cè)試系統(tǒng)、振動(dòng)輸送設(shè)備、小型馬達(dá)、電磁離合器/制動(dòng)器、打印機(jī)系統(tǒng)等各領(lǐng)域產(chǎn)品。基于其自己獨(dú)特的傳動(dòng)控制和能源控制技術(shù),在各種領(lǐng)域提供相對(duì)應(yīng)的產(chǎn)品。
今天,SINFONIA在各個(gè)領(lǐng)域孕育的技術(shù)沿用至"再生醫(yī)學(xué)","物流"和"農(nóng)業(yè)"領(lǐng)域產(chǎn)品的開發(fā),進(jìn)一步為可持續(xù)發(fā)展社會(huì)做出貢獻(xiàn)。
SINFONIA日本昕芙旎雅株式會(huì)社 SHINKO神鋼
SINFONIA昕芙旎雅SHINKO半導(dǎo)體設(shè)備
300mm/200mm搭載自動(dòng)切換功能的 Load Port
SELOP08C12F-S81 Series
200mm wafer operation
300mm wafer operation
SINFONIA昕芙旎雅SHINKO基板自動(dòng)搬送裝置(EFEM)
面向LED/功率半導(dǎo)體
新型搬送設(shè)備登場(chǎng)!
適用于LED/功率半導(dǎo)體基板大型化需求
適用于6/8英寸基板
300mm EFEM
SINFONIA昕芙旎雅SHINKO微環(huán)境設(shè)備
支持更先進(jìn)、更高效的半導(dǎo)體工藝
SINFONIA昕芙旎雅SHINKO300mm N2 EFEM
控制EFEM內(nèi)Ox/H2O,適應(yīng)最尖端生產(chǎn)工藝需求
SINFONIA昕芙旎雅SHINKO半導(dǎo)體設(shè)備
支持進(jìn)一步微細(xì)化的次時(shí)代機(jī)型!
300mm FOUP Load Port
(Smart SELOP-8系列)
SINFONIA昕芙旎雅SHINKO半導(dǎo)體設(shè)備
為次時(shí)代品質(zhì)提升(12nm, 7/8nm)做出貢獻(xiàn)
氮?dú)獯祪?00mm FOUP Load Port
Smart SELOP-7-N系列
SINFONIA昕芙旎雅SHINKO半導(dǎo)體設(shè)備
300/200mm自動(dòng)切換功能 Load Port
Smart SELOP-7 新系列
最適合300mm與200mm晶圓混合生產(chǎn)線
300mm晶圓對(duì)應(yīng)LP僅需裝載開放式晶圓盒適配器便可適用于200mm晶圓對(duì)應(yīng)LP!
SINFONIA昕芙旎雅SHINKO半導(dǎo)體設(shè)備
為后段工序的自動(dòng)化提供支持
切割架 Load Port
Tape Frame FOUP Load Port
滿足無顆粒、反復(fù)操作下的高耐久性等半導(dǎo)體制造設(shè)備所需的規(guī)格。
SINFONIA昕芙旎雅SHINKO半導(dǎo)體設(shè)備
300mm FOUP Load Port
Smart SELOP-7(SELOP12F25-S7系列)
高可靠性、銷量No.1!
采用大型指示器,一臺(tái)即搞定所有Fab.
SINFONIA昕芙旎雅SHINKO半導(dǎo)體設(shè)備
支持高效率、穩(wěn)定的晶元移位
分揀機(jī)

300mm/200mm
搭載自動(dòng)切換功能的 Load Port
可兼容300及200mm晶員的 新一代機(jī)型
只需對(duì)300mmFOUP及200mm Open Cassette適配器進(jìn)行切換即可使用!

搭載載具自動(dòng)識(shí)別功能
對(duì)應(yīng)Mapping
搭載晶圓彈出傳感器
Two types of Open Cassette Adapter
Many Experiences
Tilt type
Low cost model
Horizontal type

Tilt type
Operation Flow

Specification
LOAD PORT | SELOP08C12F-S81 Series |
---|
Dimensions | W474mm x D547mm x H1381mm(Load Port) |
---|
W455mm x D300mm x H432mm(Tilt-type 200mmOCA) |
W430mm x D315mm x H373mm(Horizontal-type 200mmOCA) |
Weight | 65kg(LP) |
---|
13.2kg(Tilt-type 200mmOCA) |
8.5kg(Horizontal-type 200mmOCA) |
| 200mm wafer operation | 300mm wafer operation |
---|
Application | 200mm 25 slot cassette (SEMI-Standard) | 300mm 25 slot FOUP (SEMI-Standard) |
---|
Cycle time | Open:11sec.(including mapping)、 Close:7sec.(excluding mapping) | Open:12sec.(including mapping)、 Close:9sec.(excluding mapping) |
---|
Door holding method | N/A | Vacuum absorption method |
---|
Detecting function | ①Open Cassette normal placement ②Stage normal placement ③Wafer mapping ④Wafer protrusion ⑤Hand safety | ①FOUP normal placement ②Foup door checking ③Wafer mapping ④Wafer protrusion ⑤Hand safety |
---|
Standard feature | ①Wafer mapping ②Controller ③Carrier base placement adjustment mechanism ④Bolts surface position adjustment mechanism |
---|
⑤Cassette side-slip Prevention ⑥300mmFOUP Infopad pin holder ⑦Stage fixation at wafer horizontal position ⑧Minimizing vibration in rotating and Power |
|
Utility | ①Power:DC24V 5A ②CDA:0.45~0.6 MPa 20 L/min ③Vacuum:-40kPa 5L/min |
---|
Communication interface | RS232C or Ethernet ※2 |
---|
Options | ①Customizable indicator panel ②Customizable switch panel ③Applicable to AC200V ④Applicable to FOSB※1 ⑤E84 ⑥E84,CID Communication(300mmFOUP only) |
---|
※1Depending on FOSB type, performance may vary. Please contact us for details.
※2Ethernet is either a registered trademark or a trademark of Xerox Corporation in the United States and/or other countries.
Outline Drawing
